bonding pad

The hardness distributing near bonding pad and strength of interface have been studied. The interface structure and bonding mechanism of electromagnetic hemicontinuous double pouring casting roll have been analyzed.

研究了结合界面附近的硬度分布和界面的结合强度，并分析了电磁半连续复合铸造轧辊的界面结构和结合机理。

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From the present study, it is found that single crystal copper wires can be bonded on the gold pad and the aluminum pad by thermosonic ball bonding and wedge bonding without gas protection.

研究结果表明，在没有保护气氛的环境下，单晶铜丝可以热超声球键合和楔键合在金衬底和铝衬底上。

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Using of new type of flushing fluid treated with mud cake breaker, and aided by large volume of low weight slurry as pad fluid, to minimize the influence of mud cake to the bonding of cement slurry, thus improve the bonding strength and quality.

采用快体冲洗液，并加以大量的低密度水泥浆前置液，尽量消除泥饼对水泥浆胶结的影响，提高界面胶结强度和质量；

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This phenomenon indicates that the strength of the IMC layers which connect the BGA and bonding pad is increased by adding nanoparticles.

这说明了钎料与焊盘连接处的IMC的强度在添加纳米颗粒后得到了明显的提高。

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To avoid this problem, the effective bonding pad sizes and spacing must be reduced.

为了避免这个问题, 有效的键合压脚尺寸和间距都必须减少.

词典精选例句

Layer thickness analysis results from a bonding pad on a circuit board, showing nanometer resolution thickness analysis.

来自电路板结合区的厚度分析，纳米尺度的厚度分析。

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This technology can be widely used for chip encapsulation in the field of micro-electronics. The core of this technology is that it achieves a vision machine to automatically recognize and locate the bonding pad on the unencapsulated semiconductor chip.

这一技术可以广泛应用于微电子行业中的芯片封装技术，它的核心是实现了对未封装的半导体芯片上的焊盘进行识别并定位的视觉机器。

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The circuit is simulated with models of bonding wire, pad and ESD circuits.

在混频器的设计与仿真过程中，同时考虑到了压焊线、焊盘、ESD电路的影响。

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In this article, bonding pad design, stencil design and assembly process of QFN device will be introduced in detail.

文章对QFN器件的焊盘设计，网板设计及组装工艺作了详细的介绍。

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New Type Roller Contour of Bonding Pad Roll for SSAW Pipe Unit

新型螺旋焊管机组焊垫辊辊型

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As the demand increasing steadily for small volume 、 high density and high heat-dissipation rate IC, the key parameter of wire bonding& pad pitch has to shrink in accordance.

由于市场对小体积、高集成度和高散热率芯片的需求量与日俱增，引线键合工艺的关键参数&焊盘间距也不断缩小以满足市场要求。

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The results show that the volume of solder, interstice height, and size of bonding pad have a remarkable effect on the 3-D shapes of LCCC solder joint.

结果表明，钎料体积、间隙高度、焊盘尺寸对LCCC焊点三维形态有显著的影响。

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The influence of junction area and bonding pad size on the dark current has been also analyzed.

文中还对器件结面积和电极尺寸等对暗电流的影响进行了比较和分析。

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This paper introduces how to recognize and locate the bonding pad from a silicon chip image with the method of Digital Image Processing and Pattern Recognition.

介绍了采用图像处理和模式识别的方法对一幅半导体芯片的图像进行焊盘的识别和定位。

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Roller contour of bonding pad roll for SSAW pipe unit has a sensitive effect on welded pipe forming and welding quality, improper roller contour may result the occurence of defects such as offset and crack of inside-welding.

螺旋焊管机组焊垫辊的辊面形状对焊管成型、焊接质量有较大的影响，不当的辊面形状有可能产生错边、内焊裂纹等缺陷。

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The hooks on side B are designed to provide optimum bonding to the urethane foam pad.

在B面的吊钩是用来给乙烷泡沫衬垫提供良好的粘接作用.

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